Chipbond Technology Corp Sustainability Reports
Chipbond Technology Corporation provides downstream packaging and testing services for the semiconductor industry. Its core operations include gold bumping, solder bumping, wafer testing, tape carrier packaging, and chip-on-glass solutions primarily targeting display driver integrated circuits.
Sector: Manufacturing
Country: Taiwan
Exchange: Taipei Exchange
LEI: 254900AK7VTHB4UYLR40
FIGI: BBG001SGCDH1
13 reports from 2019 to 2025
