Disco Corp Sustainability Reports
DISCO CORPORATION designs, manufactures, and sells precision semiconductor processing equipment, including dicing saws, laser saws, grinders, and polishers. It also produces related diamond abrasive tooling and components used in silicon wafer production.
Sector: Manufacturing
Country: Japan
Exchange: Tokyo Stock Exchange
LEI: 529900X0YGDYM51H4Q86
FIGI: BBG001S6J672
17 reports from 2009 to 2026
