Mi Technovation Bhd Sustainability Reports
The company designs, develops, and manufactures advanced wafer-level chip-scale packaging (WLCSP) sorting machines and semiconductor materials. It operates across specialized units focused on semiconductor equipment, materials, and technologies.
Sector: Manufacturing
Country: Malaysia
Exchange: Bursa Malaysia
FIGI: BBG00KL4NJ88
14 reports from 2018 to 2026