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Mi Technovation Bhd Sustainability Reports

The company designs, develops, and manufactures advanced wafer-level chip-scale packaging (WLCSP) sorting machines and semiconductor materials. It operates across specialized units focused on semiconductor equipment, materials, and technologies.

Sector: Manufacturing

Country: Malaysia

Exchange: Bursa Malaysia

FIGI: BBG00KL4NJ88

14 reports from 2018 to 2026