Tianshui Huatian Technology Co Ltd Sustainability Reports
The company provides assembly, packaging, and testing services for semiconductor integrated circuits and MEMS sensors. It offers an integrated suite of OSAT capabilities including wafer bumping, probing, grinding, and various IC packaging options.
Sector: Manufacturing
Country: China
Exchange: Shenzhen Stock Exchange
FIGI: BBG001T00932
1 reports from 2022 to 2022