Xintec Inc Sustainability Reports
Xintec Inc. operates as a dedicated subcontractor providing advanced wafer-level packaging and testing services within the semiconductor industry. Its core capabilities include 3D wafer-level chip scale packaging (WLCSP), post-passivation interconnection (PPI) services, and specialized packaging for optical and MEMS sensors.
Sector: Manufacturing
Country: Taiwan
Exchange: Taipei Exchange
FIGI: BBG001SG9C32
15 reports from 2015 to 2025