Annual Report

Overview

The report describes Xintec’s 2015 transition of its 300mm 3D wafer-level chip-scale packaging line into volume production and sales revenue of NT$4,878 million. It reports 60 internal training sessions and nearly 218.5 company-wide training hours. The company also formally established a Corporate Social Responsibility Committee, with its Corporate Sustainable Development project set to begin in 2016.

Document

Report type: Annual Report with Sustainability Disclosures
Class: Embedded
Scope: Full report
Fiscal year: 2015
Period: Ends 31 December 2015
Language: English
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